Likhalase tsa phetolelo tsa AIkopanya temoho ea puo, phetolelo ea mochini, le molumo oa mohala ho liaparo tsa mahlo tse bobebe. Ka 2025, lintlafatso tsa AI ea sesebelisoa, mefuta ea puo ea tlhaho e sebelisang matla a tlase, le meralo e kopaneng ea audio ea Bluetooth li entse hore lisebelisoa tsena li sebetse letsatsi le letsatsi - eseng feela li-laboratories.
China ke setsi sa tlhahiso: liketane tsa phepelo tse holileng bakeng sa li-optics, likarolo tsa molumo, ente ea polasetiki, liforeimi tsa tšepe, kopano ea PCB, le tloaelo ea firmware. Ha u lekola mofani oa thepa, u tlameha ho sheba ka nqane ho theko: bokhoni ba tlhahiso, firmware R&D, likhetho tsa enjine ea ho fetolela (cloud vs offline), le taolo e thata ea boleng ka likhalase tse bohlale, mekhoa ea likhalase tsa mofetoleli oa Bluetooth e tla etsa qeto ea hore na sehlahisoa se tla atleha 'marakeng.
Tlaleho ena e hlahisa mabitso le lifeme tsa Machaena tse hloahloa, 'me e fana ka buka ea ho bapala mohato ka mohato bakeng sa ho hlahisa likhalase tsa phetolelo tsa AI tsa poraefete.
Mabenkele a Ligalase a Phetolelo a 10 a China AI le lifeme (2025) — Lintlha tse qaqileng
1) Wellypaudio — Feme-Kereiti ea OEM bakeng sa Likhalase tsa Phetolelo tsa AI
Boemo:OEM / ODMmoetsi o tsepamisitse maikutlo ho liaparo tsa molumo le likhalase tsa mofetoleli oa AI bakeng sa khoebo ea e-commerce ea lefatše le liteishene tsa thekiso.
Matla:
● Ho etsa lihlahisoa tsa ho qetela (liforeimi tsa mechine, optics, PCBA, kopano ea ho qetela).
● Sehlopha sa firmware se khona ho kopanya li-SDK tsa phetolelo tse tloaelehileng (Google/DeepL-compatible APIs, custom inference engines).
● Flexible MOQ: li-batches tsa sampole ho tloha ho li-unit tse 50–200, tse ka fokotsoang ho isa ho 10k+ khoeli le khoeli.
● QC workflow: AOI bakeng sa PCB, IPQC nakong ea kopano, tlhahlobo ea botsofali (lihora tse 24-72), le liteko tse sa reroang tsa ho thothomela / ho theoha.
Litlhaloso tse tloaelehileng Wellp e ka fana ka tsona:
● Nako ea ho fetolela: 300–700 ms (e thusitsoe ke maru), 800–1500 ms (mefuta ea kantle ho marang-rang)
● Betri: 200–350 mAh tempele e 'ngoe (lihora tse 8–18 ha u ntse u emetse audio)
● Bluetooth: 5.2 + LE Audio tšehetso boikhethelo
● Lipuo: 100+ e tšehetsoeng ke maru; Liphutheloana tse 6–20 tsa puo ntle le inthanete
Hobaneng u khetha Wellypaudio:
Litheko tse tobileng fekthering, tokiso e matla ea molumo, le protocol e netefalitsoeng ea QC bakeng sa bareki ba mabenkele le ba ikemetseng.
2) TCL Smart Vision Series
● Positioning: Consumer electronics brand leveraging the TCL's retail channels. Moralo o motle oa indasteri, kananelo ea lebitso.
● Lintlha: Molemo ka ho fetisisa bakeng sa ho qalisoa ha thekiso ea marang-rang moo moralo le tšehetso ea ho bapatsa li leng bohlokoa.
3) Likhalase tsa Lenovo ThinkVision
● Position: Likhalase tse bohlale tse shebaneng le tlhahiso bakeng sa baeti ba khoebo le theko ea likhoebo.
● Lintlha: Limaekerofounu tse ntle, ntlafatso ea puo bakeng sa tikoloho e lerata, tšehetso ea likhoebo le litiisetso.
4) Rokid AR & Phetolelo Series
● Boemo: Mokhoa oa pele oa AR; e ipabola ka ho fetoleloa ha molumo le maemo bakeng sa likhoebo le bohahlauli.
● Lintlha: E matla ho kopantseng likoahelo tsa AR le lingoloa tse bonoang, tse thusang maetong a tataisoang.
5) Vuzix (China-Partnered OEM Models)
● Position: Lisebelisoa tsa boemo ba khoebo tse entsoeng ka tšebelisano le lifeme tsa Machaena. Ketane ea phepelo e tšepahalang haholo le litifikeiti.
6) Nreal (Xreal)
● Boemo: Moeta-pele oa MR oa bareki o fetela likarolong tsa phetolelo; boiphihlelo bo botle ba pono le ecosystem ea nts'etsopele.
7) LLVision
● Boemo: Litharollo tsa 'Muso le likhoebo; e shebana le ho nepahala ha mongolo le liphetolelo tse sireletsehileng.
8) INMO Air
● Position: Likhalase tse bobebe, tse shebaneng le maeto tse nang le navigation + limahano tsa phetolelo.
9) RayNeo Air
● Positioning: Ponahalo ea subtitle e bonoang hammoho le molumo oa Bluetooth; e loketse baeti ba batlang mantsoe a ngotsoeng ka sesebelisoa.
10) HiAR Smart Glass
● Boemo: Tšebeliso ea thuto le indasteri; tšehetso e matla ea nako e telele ea firmware le tšebeletso ea tšimo.
Lintlha tsa bohlokoa tsa tekheniki ho bapisa (lenane la bareki)
Ha u bapisa likhalase tsa phetolelo tsa bluetooth tse se nang mohala ho tsoa ho barekisi, lekola likarolo tsena tsa tekheniki:
1. Enjine ea phetolelo le ho nepahala:
Cloud API (Google/DeepL/Azure) khahlano le mefuta e teng ka har'a sesebelisoa (tinyLM, edge-optimized transformer). Cloud e nepahetse haholoanyane 'me e tšehetsa lipuo tse ngata; offline ho bonolo ho boloka lekunutu ebile ho bonolo ho boloka mantsoe a makhutšoane.
2. Boleng ba temoho ea puo (ASR):
Moralo o hlophisitsoeng oa maekrofono, ho khanya le ho hatella lerata ho bontša hore na likhalase li khona ho utloa puo libakeng tse lerata hakae.
3. Sisteme e nyane ea molumo:
Bakhanni ba libui ka tempeleng, lerata, karabelo ea khafetsa, le EQ e fetolehang.
4. Bluetooth stack:
Bluetooth LE Audio vs ea khale A2DP/HFP; tšehetso ea lintlha tse ngata; likhetho tsa codec (SBC/AAC/aptX/LDAC).
5. Betri le ho tjhaja:
Lintlha tsa mAh, tefiso e potlakileng ea USB-C, khesi ea ho tjhaja waelese (boikhethelo).
6. Matšeliso & Optics:
Kabo ea boima ba 'mele, likhetho tsa lense (sefa se khanyang se putsoa, ho kenngoa ho lokiselitsoeng lengolo la ngaka), tekanyo ea IP bakeng sa mongobo.
7. Firmware & SDK:
Mokhoa oa ntlafatso oa OTA, SAT/OTA e tšehelitsoeng, le li-SDK tsa balekane bakeng sa lits'ebeletso tsa tloaelo.
8. Tšireletso le boinotšing:
Mekhoa ea ts'ebetso ea lehae, boot e sireletsehileng, firmware e patiloeng.
Phallo e tloaelehileng ea tlhahiso bakeng sa likhalase tsa phetolelo tsa AI (seo feme e se etsang)
1. Moralo oa indasteri & DFM: phethela foreimi, hinge, le sebaka se ka hare sa PCBA le betri.
2. Ho fumana likarolo: lilense (fektheri ea optical), liforeimi tsa tšepe / polasetiki (mold ea ente), lisele tsa betri, li-microphone tsa MEMS, li-speaker driver, Bluetooth SoC, flash memory, le microcontrollers.
3. Moralo le kopano ea PCB:SMT, ho beoa ha karolo, ho soasoa ka reflow, tlhahlobo ea AOI.
4. Khokahano ea Firmware: stack ea lentsoe, stack ea Bluetooth, moreki oa phetolelo; quantization ea mofuta oa lehae ha e sa sebetse.
5. Kopano ea mechine: kenya PCBA, ho tiisa sekhomaretsi, ho kenya lense.
6. Teko & QC: teko e sebetsang, ho theoha / ho sisinyeha, liteko tsa kutloisiso ea microphone, tlhahlobo ea potoloho ea betri, botsofali.
7.Packaging & labeling: ho paka ho itokiselitse moetlo, buka ea mosebelisi, mangolo a CE/FCC.
Lifeme tse joaloWelllyptsamaisa mehato ena ka li-checkpoints tse tlalehiloeng le traceability ea batch ho ts'ehetsa likopo tsa kamora thekiso.
Lethathamo la taolo ea boleng (e sebetsang, boemo ba feme)
● QC e kenang (IQC): hlahloba mamello ho lilense, litekanyo tsa foreimi, bonnete ba karolo (libetri le SoCs).
● Tlhahlobo ea PCB: AOI + X-ray bakeng sa likarolo tsa BGA.
● Teko ea tšebetso: ho bulela, ho tsamaisa Bluetooth, ho lata maeke le tlhahiso ea libui, tlhahlobo ea tšebetso ea phetolelo (mohlala oa lipoleloana).
● Teko ea botsofali: ts'ebetso e tsoelang pele ho 40 ° C bakeng sa lihora tse 24-72 ho senola liphoso tsa pele.
● Tšireletso ea metsi/lerōle: Teko ea IPX haeba e batloa.
● Boithuto bo sa reroang: 3–5% sampole bakeng sa ho theoha 'meleng, mokhathala o itseng, le tlhahlobo ea ho qetela.
● Pele ho thomello QA: ho saena lethathamo le felletseng le ho lateloa ha nomoro ea serial.
Setifikeiti le ho lumellana le tlhoko
Haeba u rera ho rekisa lefatšeng ka bophara, taba e latelang ke:
● CE (Europe) - EMC, LVD, RoHS.
● FCC (US) – FCC Karolo ea 15 ea lisebelisoa tsa seea-le-moea tse sa ngolisoang ka molao.
● UKCA (UK) - letšoao la ho lumellana le post-Brexit bakeng sa limmaraka tsa UK.
● Litumello tsa seea-le-moea bakeng sa limmaraka tse kholo (mohlala, Japane TELEC, Australia RCM)
Lifeme tse holimo li tla fana ka litlaleho tsa liteko le ho thusa ka ts'ebetso ea lehae ea ho faela.
Ho fumana leano le malebela a lipuisano bakeng sa bareki
1. Qala ka disampole tsa boenjineri: Netefatsa thari ya diphetolelo, ho lata lentswe, le boiketlo pele o itlama ho lefella litšenyehelo.
2. Kopa BOM le litlaleho tsa liteko: Tiisa likarolo tsa 'nete le litiisetso tsa mofani oa thepa.
3. Buisana le MOQ ka li-trade-offs: Amohela liforeimi kapa mebala e tloaelehileng ho theola MOQ; lefa lisebelisoa feela bakeng sa mebala kapa lisebelisoa tse ikhethileng.
4. Kopa IP/firmware escrow clause: e u sireletsa haeba mofani oa thepa a sebelisa firmware ea hau e tloaelehileng bakeng sa ba bang.
5.Plan bakeng sa liapdeite tsa OTA tsa firmware: etsa bonnete ba hore mofani oa thepa o tšehetsa OTA mme o fana ka li-staging/test builds.
6.Hlahloba mokhoa oa QC: hlahloba ka mokhoa o nepahetseng nakong ea tlhahiso le pele ho thepa.
Lintlha tsa khoebo - Litefiso le litekanyetso tsa MOQ (2025)
● Diyuniti tsa disampole (tseo di sa kgetheheng):US$60–120 yuniti ka nngwe ho itshetlehile ka mantswe le dikarolo tsa phetolelo.
● Nyenyane ea OEM e matha (100–500 diyuniti, mokhoa o itseng oa ho ikhethela):US$45–85 unit.
● Ho hlahisa ka bongata (5,000+): US$28–55 ka yuniti ho itšetlehile ka likarolo (SoC, betri, lense) le logo/packaging.
MOQ e ipapisitse le tloaelo: lebokose le hatisitsoeng + bukana hangata e tlase; liforomo tse tloaelehileng le liforeimi tse ikhethang tsa tšepe li phahamisa MOQ le litefiso tsa lisebelisoa.
Senepe le mekhoa ea 'maraka (2025)
● Bakhanni ba kholo ea 'maraka: ho qalella ha maeto, ho sebetsa ka lipuo tse ngata ka thōko, ho amoheloa ha B2B litabeng tsa ho amohela baeti / bohahlauli, le linyeoe tsa tšebeliso ea thuto.
● Mekhoa ea tekheniki:edge-LM quantization bakeng sa phetolelo e sebetsang ntle le inthanete; Bluetooth LE Audio adoption; ho eketseha ha tshebediso ya ho tsamaisa lesapo kapa dikhanni tse haufi le tsebe bakeng sa boinotshi.
● Retail trends:bundles market (likhalase + companion app subscription), le likhetho tsa phetolelo ea SaaS moo bareki ba lefang khoeli le khoeli bakeng sa boleng bo holimo ba phetolelo.
Litekanyetso ka 2025 li hakanya karolo ea phetolelo e ntseng e hola ka potlako (CAGR ka linomoro tse habeli vs 2024 baseline), empa phaello e ipapisitse le ts'ebetso ea chelete ea software le tšehetso ea firmware kamora thekiso.
FAQ Ka Likhalase tsa Phetolelo tsa AI
Q1 - Likhalase tsa phetolelo ea AI li nepahetse hakae libakeng tse lerata?
Ho nepahala ho ipapisitse le lethathamo la maekerofounu, sebopeho sa khanya, le mofuta oa ASR. Mefuta e phahameng ea likhoebo tse nang le li-mics tsa 4+ MEMS le beamforming e boloka > 90% ho nepahala ha lerata le itekanetseng; mefuta ea bareki e fapana ho feta.
Q2 - Na liphetolelo li ka etsahala ntle le marang-rang?
Ho joalo - lifeme tse ngata li fana ka liphutheloana tsa lipuo ntle le inthanete bakeng sa lipuo tse 6–20. Mefuta e kantle ho Marang-rang e nyane ebile ha e nepahale ho feta mefuta ea maru empa e ntse e ntlafala kapele.
Q3 - Bophelo ba betri bo lebelletsoeng ke bofe?
Mokhoa o tloaelehileng oa ho bapala molumo o tsoelang pele: lihora tse 6-12; linako tsa ho fetolela (maeke o sebetsang/ho mamela) a fokotsa nako ea ho sebetsa. Standby e ka nka matsatsi a mangata.
Q4 - Phetolelo e potlakile hakae (latency)?
E thusitsoe ke maru: hangata 300–700 ms hammoho le nako ea marang-rang. Offline: 800–1500 ms ho latela boholo ba mohlala.
Q5 - MOQ ea sebele ea OEM ke efe?
Likhetho tsa lisampole le li-batch tse nyane li teng ho tsoa ho li-unit tse 50-200 haeba u amohela liforeimi tse tloaelehileng le mokhoa o fokolang oa ho etsa firmware. Hangata hlobo e tloahelehileng e hloka 500–2,000 MOQ.
Q6 - Na ke hloka lisebelisoa tse khethehileng tsa mohala?
Likhalase tse ngata li amahanngoa le app e tsamaisanang le eona bakeng sa likarolo tse atolositsoeng (histori ea phetolelo, liapdeite tsa firmware, EQ ea tloaelo). Netefatsa hore mofani oa thepa o fana ka tšehetso ea iOS le Android SDK.
Q7 - Na likhalase li bolokehile (lilense tse khanyang tse putsoa le maemo a molumo)?
Barekisi ba tsebahalang ba fana ka litlaleho tsa tlhahlobo bakeng sa ho sefa mabone a maputsoa le meeli ea ka hare ho SPL e tloaelehileng ho latela litataiso tsa polokeho ea kutlo.
Khothaletso ea ho qetela & mehato e latelang
1. Etsa mohlala oa 10–20 oa yuniti ea odara ea boenjiniere ka lenane le khuts'oane la barekisi (ho kenyelletsa le Wellyp Audio). Lekola boleng ba ASR, botsitso ba ho hokahanya, bophelo ba betri, 'me u hahe boiketlo.
2. Kopa ho etela lifeme kapa ho hlahlojoa ke batho ba bang pele ho tlhahiso ea bongata.
3. Rera firmware & ka mor'a thekiso: fana ka tekanyetso bakeng sa lilemo tse 1-2 tsa tšehetso ea OTA le lisebelisoa tsa puo.
4. Etsa phapang ea lihlahisoa: liforeimi tsa likhalase tsa mahlo, lilense tsa premium (polarized kapa prescription-reading-reading), kapa litšebeletso tsa phetolelo ea peeletso.
Li-earbud tsa OEM ke tsela e matla ea hore lihlahisoa li fe bareki ba tsona lihlahisoa tse ikhethang, li ikhethoe ho bahlolisani, 'me li thehe bots'epehi ba nako e telele. Ka ho sebelisana 'moho le feme ea profeshenale ea li-headphone joalo ka Wellyp Audio, u fumana monyetla oa ho fumana tsebo ea R&D, tlhahiso e tsoetseng pele, le tšehetso ea lefats'e ea thomello.
Haeba u batla molekane ea tšepahalang bakeng sa li-earphone tsa OEM, lits'ebeletso tsa barekisi ba li-headphone, kapa ho etsa li-earphone bakeng sa mohala oa hau o latelang oa sehlahisoa, ikopanye le Wellypaudio kajeno 'me re thehe morekisi ea latelang oa lebitso la hau.
Khothalletsa ho Bala
Nako ea poso: Sep-25-2025